文章詳情
錫膏印刷機知識-錫膏厚度控制規(guī)格
日期：2025-05-15 01:28
瀏覽次數(shù)：3323
摘要：
錫膏印刷機知識-錫膏厚度控制規(guī)格
Solder Paste height control Spec錫膏厚度控制規(guī)格
1.Purpose 目的：
This document is in order to control prodution line's solder paste height limit
此文件是為了規(guī)范生產(chǎn)線錫膏厚度的控制限度。
2.Scope 范圍：
Application wuxi factroy 適用于無錫工廠
3.Reference file參考文件：
According to the solder paste height VA of each workcell
參考每個項目組錫膏厚度的VA
4.Instruction說明 ：
Generally: Stencil thickness + 1.0 mil then +/-1.5mil
For example: stencil thickness=5mil ;solder paste height=(5+1)+/-1.5mil;solder paste height is 4.5~7.5mil
Note:According to the requirement when customer has a special request and write it down in correlative file DOCUMENT NO.
通常：錫膏厚度為鋼網(wǎng)厚度+1.0 mil再+/-1.5mil
例如：鋼網(wǎng)厚度=5mil;錫膏厚度=（5+1）+/-1.5mil;即錫膏厚度為4.5~7.5mil SHEET 1 OF 1
備注：如果客戶有特殊要求，按照客戶的要求執(zhí)行并且在相關(guān)文件上注明。